Yocto Board Support Package
Board Support Package
In embedded systems, a board support package (BSP) is an implementation of specific support code (software) for a given (device motherboard) board that conforms to a given operating system. It is commonly built with a bootloader that contains the minimal device support to load the operating system and device drivers for all the devices on the board. Wikipedia
Intel® Edison Board Firmware Software Release
The Intel® Edison Board Support Package offers these features:
Kernel image based on Linux kernel 3.10.17
U-boot second stage bootloader
Bluetooth and Wi-Fi connectivity
Intel cloud connectivity middleware
Many base Linux packages provided by the Yocto project
Intel® Edison Board Support Package Document
This document is for software and system engineers who are building and customizing images, kernels, and native SDKs for the Intel® Edison Development Platform. Precompiled versions of the BSP are available on the Intel website. Users who don’t want to modify the default images don’t need to read this document.
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